CUSTOM DESIGN
TEMPERATURE CONTROL SYSTEMS
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CUSTOM DESIGN SERVICES

Just let us know what your temperature control requirements are and our engineering team will design it for you.

We design, manufacture and sell systems that precisely control the temperature of processes used to manufacture semiconductors. Our patented technology has advanced the state of the art in Temperature Control Systems (TCS). Our systems operate with higher performance, are more reliable and cost effective and enable semiconductor manufacturers to increase wafer output significantly compared to leading competitive systems.

Our systems are standard equipment in several Applied Materials tools used in semiconductor manufacturing. In addition, our systems are currently available to replace temperature control systems in several types of equipment, manufactured by Applied Materials, Tokyo Electron, Novellus and LAM Research Corporation and installed in existing semiconductor manufacturing facilities. Our systems are installed in more than 40 semiconductor manufacturing facilities worldwide.

Our systems will achieve continuous operation of more than 30,000 hours without requiring maintenance. We believe leading competitive temperature control systems require frequent maintenance. In addition, other compelling attributes of our temperature control systems as contrasted with leading competitive systems are that they:
    . Cool at least four times faster.
    . Heat at least two times faster.
    . Reduce floor space per channel of coolant fluid by over 70%.
    . Have substantially lower operating costs.

All of our system configurations are tailored to requirements of the specific processes using modular components. Many of our key components are based on proprietary technology. Many of the components are common to each configuration, including the thermal expansion valves and their controls, pump mechanisms, receiver, compressor, evaporators, heaters, electrical system, system controls and interlocks, piping, and frame and enclosure. System and parts commonality reduces user's training, parts inventory, repair facility, and support management costs.

Tailoring a basic system to a particular end user or OEM (Original Equipment Manufacturer), generally requires selection and incorporation of the mechanical and electrical interfaces to the wafer manufacturing equipment and definition of components for the particular temperature control requirements. We utilize advanced, modular platform-based systems, which facilitate simple reconfiguration for multiple applications. These platform-based systems improve manufacturing efficiency and provide parts commonality across a broad range of applications.

We also design prototype testing system configurations for a number of additional OEM wafer processing tools which we believe are available to end users for potential replacement of their existing temperature control systems.

CHANNEL 1
CHANNEL 2
(OPTIONAL)

CHANNEL 3
(OPTIONAL)

CHANNEL 4
(OPTIONAL)
TEMPERATURE
CONTROL
 TEMP RANGE
TEMP ACCURACY
FREQUENCY OF CHANGING TEMP SET POINT
TEMP REVOVERY RATE
CAPACITY COOLING
HEATING
HEAT
TRANSFER
LOOP		 TYPE OF HEAT TRANSFER FLUID
FLUID FLOW
PUMP PRESSURE
# OF LOOPS FED FROM EACH PUMP
DISTANCE FROM CHILLER TO TOOL
SIZE OF CONNECTION
CONNECTION

TYPE OF CONNECTION
TYPE OF SIGNAL
PROTOCOL
SAFETY EMO
INTERLOCKS
EQUIPMENT INTERFACING
FACILITY
WATER		 FLOW
PRESSURE
TEMPERATURE RANGE
SIZE OF CONNECTION
FACILITY
POWER		 VOLTAGE
MAX AMPERAGE
FREQUENCY / PHASE
CERTIFICATIONS  
DIMENSIONS MAX L/W/H
WEIGHT MAX WEIGHT
     
TOOL MANUFACTURER
AND MODEL #
CURRENT CHILLER
HEAT EXCHANGER
     
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